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LASER MACHINE

INSPECTION MACHINE

INSPECTION MACHINE

Inspection equipment refers to tools and systems used to inspect and analyze the quality and performance of materials, components, and products during industrial production. These devices utilize technologies such as vision, ultrasonic, laser, X-ray, and others to detect and evaluate defects, dimensions, appearance, and functionality. They are widely employed in manufacturing, electronics, automotive industries, and more.

PROCESSING STEPS

1. Requirement Analysis
and Equipment Selection

2. Preparation and
Installation

3. Calibration and Setup

4. Inspection Process

5. Data Collection and
Analysis

6. Result Validation
and Feedback

CHARACTERISTICS

  • High Precision: Capable of detecting defects at the micron or nanometer level, providing accurate results.

  • High Automation: Modern industrial inspection equipment automates most processes, improving efficiency and real-time monitoring.

  • Non-Destructive Testing: Most inspections do not damage the item, making them suitable for finished and semi-finished products.

  • Diverse Technologies: Offers various inspection methods such as vision, ultrasonic, X-ray, and more based on applications.

  • Do not cover all defect types: Technical limitations of some devices may not cover all defect types.

APPLICATIONS

Manufacturing Industry

For surface inspection and dimensional measurement.
Example: Smart cameras detect scratches and smudges on smartphone casings.

Food and Pharmaceutical Industry:

X-ray equipment identifies metal contaminants in pharmaceutical packaging.

Automotive Industry

Inspection of dimensions, strength, and assembly precision of automotive parts.
Example: Laser scanning inspects machining errors in engine blocks.

Energy Industry

Detects defects in batteries and solar panels. Example: Thermal imaging equipment identifies abnormal heat distribution in solar panels.

Electronics Industry

For inspecting solder joints and circuit connections on PCBs.
Example: X-ray inspection checks internal soldering in chip packages.

Specifications

线数 (Line/inch)
网眼间距 (μm)
最大薄片尺寸 (mm)
开口部精度保证区域
开口部精度保证区域
最小~最大 开口尺寸 (μm)
150
169.3
180
±3
≦φ100
23~150
114
222.8
240
±3
≦φ125
30~200
100
254
180
±3
≦φ100
40~231
60
423.3
180
±3
≦φ100
80~396
250
101.6
180
±3
≦φ100
13~82
325
78.2
380
±4
≦φ300
8~62
325
78.2
380
±2
≦φ180
8~62
333
76.3
220
±3
≦φ100
6~60
400
63.5
380
±2
≦φ150
5~47
400
63.5
380
±4
≦φ300
5~47
400
63.5
180
±2
≦φ100
5~47
500
50.8
240
±1
≦φ125
4~35
500
50.8
380
±1
≦φ150
4~35
500
50.8
180
±3
≦φ300
4~35
500
50.8
180
±1
≦φ75
4~35
640
39.7
380
±3
≦φ300
3~28
640
39.7
380
±1
≦φ150
3~28
750
33.9
380
±3
≦φ300
2~22
750
33.9
380
±1
≦φ150
2~22
750
33.9
240
±1
≦φ125
2~22
876
29
380
±3
≦φ300
2~20
875
29
240
±1
≦φ125
2~19
876
29
380
±1
≦φ150
2~20
2540
10
250×300
±1
≦100×150*
2~5*
2000
12.7
250×300
±1
≦100×150*
2~6*
1500
16.9
180
±1
≦φ75
2~8
1500
16.9
240
±1
≦φ125
2~5
1000
25.4
240
±1
≦φ125
2~12
1000
25.4
380
±1
≦φ150
2~16
1000
25.4
380
±3
≦φ300
2~16

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